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Influence of Trench Design on the Electrical Properties of 650V 4H-SiC JBS Diodes

 
: Rusch, Oleg; Moult, Jonathan; Erlbacher, Tobias

:

Gammon, Peter M.:
Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials (ECSCRM 2018), held in Birmingham, UK, in September 2018
Durnten-Zurich: TTP, 2019 (Materials Science Forum 963)
ISBN: 978-3-0357-1332-9
ISBN: 978-3-0357-2332-8
ISBN: 978-3-0357-3332-7
pp.549-552
European Conference on Silicon Carbide and Related Materials (ECSCRM) <12, 2018, Birmingham>
English
Conference Paper
Fraunhofer IISB ()
4H-SiC; Junction Barrier Schottky (JBS) Diode; trench; Schottky Barrier Lowering; Design Study; ohmic contact

Abstract
This work presents a design study of customized p+ arrays having influence on the electrical properties of manufactured 4H-SiC Junction Barrier Schottky (JBS) diodes with designated electrical characteristics of 5 A forward and 650 V blocking capabilities. The effect of the Schottky area consuming p+ grid on the forward voltage drop, the leakage current and therefore the breakdown voltage was investigated. A recessed p+ implantation, realized through trench etching before implanting the bottom of the trenches, results in a more effective shielding of the electrical field at the Schottky interface and therefore reduces the leakage current. Customizing the p+ grid array in combination with the trench structure, various JBS diode variants with active areas of 1.69 mm2 were fabricated where as forward voltage drops of 1.58 V @ 5 A with blocking capabilities up to 1 kV were achieved.

: http://publica.fraunhofer.de/documents/N-552147.html