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HoloPort - 3D-Sensor for machine tools

: Seyler, Tobias; Engler, Johannes

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VDI/VDE-Gesellschaft Meß- und Automatisierungstechnik -GMA-, Düsseldorf; Informationstechnische Gesellschaft -ITG-:
20. GMA/ITG-Fachtagung Sensoren und Messsysteme 2019 : 25. und 26. Juni 2019, Nürnberg Convention Center
Wunstorf: AMA Service, 2019
ISBN: 978-3-9819376-0-2
Fachtagung Sensoren und Messsysteme <20, 2019, Nürnberg>
Conference Paper, Electronic Publication
Fraunhofer IPM ()
digital holography; machine tool; inline inspection; parallel computing; GPU

Manufacturing of high-precision components requires accuracies that even the most modern processing machines are often unable to deliver reliably. Slightly worn tools, incorrectly calibrated sensors or even different trajectories can lead to component integrities that do not comply with the desired specifications. Quality control is usually performed on randomized samples in special measuring rooms outside the machine tool. Closed-loop quality control is currently a cumbersome iterative process. We present the digital-holographic sensor system HoloPort that measures the two dimensional surface integrity of machined components in the sub-micrometer range directly inside machine tools: To our knowledge, HoloPort is the first wireless (digital holographic) sensor inside a machine tool worldwide. Being fully integrated, it features not only a multi wavelength interferometer but also a miniaturized GPU. This allows full data evaluation directly in the sensor and thus inside the machine tool. A single measurement is taken and processed within 3 s in wireless operation. HoloPort can be easily integrated into a variety of machine tools. This contribution includes detailed information about the sensor architecture. Experimental results on milled parts show the system's performance and illustrate possible inline applications as well as perspectives of the sensor.