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Performance comparison of advanced power electronic packages for automotive applications
|Société des Ingénieurs de l'Automobile -SIA-:|
International Conference on Automotive Power Electronics 2006. Conference Proceedings. CD-ROM : 21.-22.06.2006, Paris, France
|International Conference on Automotive Power Electronics <2006, Paris>|
| Conference Paper|
|Fraunhofer IZM ()|
The paper presents an overview over advanced power electronic package solutions for multi-chip modules. To assess their thermal performance, simulation models of the packages are analysed regarding the temperature distribution in the assemblies. The improvement which may be achieved with double-sided cooling of the modules is simulated and compared to the standard chip & wire module. From the simulations, the transient impedance of the chip?s hot-spot is derived and further processed in an automotive case study.