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Very-Thin System-in-Package Technology for Structural Analysis

 
: Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias

:
Fulltext urn:nbn:de:0011-n-5460328 (491 KByte PDF)
MD5 Fingerprint: d2bf0f9097a2fc511ff53df9e77c6928
Created on: 21.5.2019


Otto, Thomas (Hrsg.) ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2019 : 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems, Barcelona, Spain, 10 - 11 April 2019
Berlin: VDE-Verlag, 2019
ISBN: 978-3-8007-4919-5
ISBN: 978-3-8007-4878-5
pp.153-160
Smart Systems Integration Conference (SSI) <2019, Barcelona>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <13, 2019, Barcelona>
English
Conference Paper, Electronic Publication
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
Fraunhofer IZM ()

Abstract
The integration of very-thin electronic systems will enable new application fields like structural analysis of components used in aviation, windmills or other critical applications. Presented are two integration options, by using flexible substrates or a RDLFirst packaging approach suitable for multiple device assembly. The RDLFirst is very thin and the flip-chip devices can be thinned also, so that the overall system gets very thin. One main difference to flexible substrate is the possible line space, which is in the region of 100um for flexible substrates and down to some um for RDLFirst.

: http://publica.fraunhofer.de/documents/N-546032.html