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Potentials of Additives for Electrolytes in ECM Processes

 
: Metzner, Martin; Santos, Claudia Beatriz dos; Schmid, Klaus; Mock, Christian; Boonyongmaneerat, Yuttanant

Bergs, T.:
14th INSECT 2018, International Symposium on ElectroChemical Machining Technology. Proceedings : Aachen, November 27-28, 2018
Aachen: Apprimus Verlag, 2018
ISBN: 978-3-86359-667-5
ISBN: 3-86359-667-6
pp.177-181
International Symposium on ElectroChemical Machining Technology (INSECT) <14, 2018, Aachen>
English
Conference Paper
Fraunhofer IPA ()
Additiv; Elektrolyt; elektrochemisches Abtragen; Galvanisieren

Abstract
The use of additives to modify layer characteristics is common in electroplating processes. The working mechanism of such additives is based on their influence on the diffusion layers of the surface whilst the electrochemical process is in progress. This causes a controlled inhibition and based on this characteristics like hardness, roughness, gloss and internal stress can be controlled in a broad range. In state of the art ECM processes such additive based inhibition effects are not used. The idea is to transform the know - how and the mechanisms of controlled inhibition from electroplating to ECM. There can be no results presented until now, the article describes the project idea.

: http://publica.fraunhofer.de/documents/N-543736.html