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3D-PCB-packaging technology for high power applications with water cooling

 
: Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B.

:
Preprint urn:nbn:de:0011-n-542685 (504 KByte PDF)
MD5 Fingerprint: 70e2d75a987d53a3940457bdaebf887b
Created on: 10.03.2007


Borgmann, H. ; Messe und Ausstellungs-GmbH, Bremen:
Actuator 2006. 10th International Conference on New Actuators & 4th International Exhibition on Smart Actuators and Drive Systems : 14 - 16 June 2006, Bremen, Germany; Conference proceedings
Bremen: Messe Bremen Ges., 2006
ISBN: 3-933339-08-1
pp.293ff
International Conference on New Actuators <10, 2006, Bremen>
International Exhibition on Smart Actuators and Drive Systems <4, 2006, Bremen>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()

Abstract
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts. The 3D-packaging technology makes it possible to stack the PCBs on top of each other and thus make full use of the third dimension. A unique space between the stacked PCB layers enables a reproducible technology without shortcuts or unconnected bumps. The paper shows an fluidic cooled PCB package with high power components. Water channels in the PCB package dissipate the heat from the inside of the package to the environment. 3D-PCB-Packages in a combination of electrical components, fluidical cooling and thermal management in a technology with stacking technology, thermal vias/layers, PCB water channels with solder rings and unique spacers can be an inexpensive technology for high integrated power applications. New applications in 3D-PCB-packages, called PCB-MEMS can be realized with the combination of electric bumps and solder rings.

: http://publica.fraunhofer.de/documents/N-54268.html