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3D-PCB-Packaging Technology for Electric and Fluidic Applications

Presentation held at "Micro System Technologies", München 5.-6.10.2005
: Schindler-Saefkow, F.; Schramm, H.; Amiri Jam, K.; Gaßmann, S.

Preprint urn:nbn:de:0011-n-542623 (326 KByte PDF)
MD5 Fingerprint: 45998eaa3c8c15e9276283e121577279
Created on: 10.03.2007

2005, 5 pp.
International Conference on Micro Electro, Opto, Mechanical Systems & Components <2005, München>
Presentation, Electronic Publication
Fraunhofer IZM ()

The 3D-packaging technology makes it possible to stack the PCBs on top of each other and thus to make full use of the third dimension. A patent for the new technology concept has been realized. The paper presents a fluidicly cooled 11-PCB-layer with high power components (48 W). Water channels in the PCB-package dissipate the heat from the inside of the package to the environment.
Active parts can be integrated with the solder ring technology. The paper shows the setup and the technology for an ultra-thin PCB micro pump. The stacking of the PCB-pump-layers was done for the first time with the solder ring technology.