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Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints

: Metasch, René; Röllig, Mike; Naumann, Uwe; Wiesenhütter, Felix; Kaufmann, R.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 20th Electronics Packaging Technology Conference, EPTC 2018 : 4-7 December 2018, Singapore
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-7668-4
ISBN: 978-1-5386-7667-7
ISBN: 978-1-5386-7669-1
Electronics Packaging Technology Conference (EPTC) <20, 2018, Singapore>
Conference Paper
Fraunhofer IKTS ()

The development team has set itself the task of creating a new type of testing system for faster and more cost-effective reliability and service life evaluation. This system additionally measure in-situ the mechanical deformation and shear forces in the electronic joints during the action of temperature change loads. The system approach begins with a new type of temperature unit, which allows very fast and homogeneous heating of the test specimen and measuring chamber. The selection of suitable sensors for high-resolution, long-term stable measurement under the influence of temperature changes is a further sub-area of system development. The developments are accompanied by virtual system design and numerical calculations. First development results for the evaluation of concrete implementation concepts are presented. The focus will be on concepts for load introduction via a frame construction, through heating, force/displacement sensors and material selection based on thermal-mechanical measurements.