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Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators

 
: Billah, M.R.; Kemal, J.N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.

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Chalmers tekniska högskola; IEEE Computer Society:
43rd European Conference on Optical Communication, ECOC 2017 : Gothenburg, Sweden, 17-21 September 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-5624-2
ISBN: 978-1-5386-4993-0
3 pp.
European Conference and Exhibition on Optical Communication (ECOC) <43, 2017, Gothenburg>
English
Conference Paper
Fraunhofer HHI ()

Abstract
We demonstrate a four-channel hybrid multi-chip module comprising InP lasers, silicon-organic hybrid (SOH) modulators, and single-mode fibers, all connected via photonic wire bonds. We transmit 56 GBd QPSK and 16QAM signals at a total data rate of 784 Gbit/s over 75 km.

: http://publica.fraunhofer.de/documents/N-537953.html