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Acoustic and photoacoustic inspection of through-silicon vias in the GHz-frequency band

 
: Brand, S.; Kögel, M.; Khaled, A.; DeWolf, I.; Moore, M.J.; Strohm, E.M.; Kolios, M.C.; Altmann, F.

ASM International; Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
ISTFA 2017, 43rd International Symposium for Testing and Failure Analysis. Conference Proceedings : November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA
Materials Park, Ohio: ASM International, 2017
ISBN: 978-1-62708-150-4 (Print)
ISBN: 1-62708-150-X
ISBN: 978-1-62708-151-1
ISBN: 1-62708-151-8
pp.95-102
International Symposium for Testing and Failure Analysis (ISTFA) <43, 2017, Pasadena/Calif.>
English
Conference Paper
Fraunhofer IMWS ()

Abstract
Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.

: http://publica.fraunhofer.de/documents/N-537942.html