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Failure analysis and defect inspection of electronic devices by high resolution cathodoluminescence

: Monachon, C.; Zielinskl, M.S.; Gachet, D.; Sonderegger, S.; Muckenhirn, S.; Barney, J.; Poppitz, D.; Graff, A.; Breuer, S.; Kirste, L.

ASM International; Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
ISTFA 2017, 43rd International Symposium for Testing and Failure Analysis. Conference Proceedings : November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA
Materials Park, Ohio: ASM International, 2017
ISBN: 978-1-62708-150-4 (Print)
ISBN: 1-62708-150-X
ISBN: 978-1-62708-151-1
ISBN: 1-62708-151-8
International Symposium for Testing and Failure Analysis (ISTFA) <43, 2017, Pasadena/Calif.>
Conference Paper
Fraunhofer IMWS ()

Quantitative cathodoluminescence (CL) microscopy is a new optical spectroscopy technique that measures electron beam-induced optical emission over large field of view with a spatial resolution close to that of a scanning electron microscope (SEM). Correlation of surface morphology (SE contrast) with spectrally resolved and highly material .composition sensitive CL emission opens a new pathway in non-destructive failure and defect analysis at the nanometer scale. Here wè present application of a modern CL microscope in defect and homogeneity metrology, as well as failure analysis in semiconducting electronic materials.