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2018
Conference Paper
Titel
3D Multilayered Ceramics - harsh environment interposer technologies expand into 3rd dimension
Abstract
The contribution deals with technologies to transform conventional planar ceramic interposers like thick film and multilayer ceramic substrates into functional 3D geometries comparable to polymer based Molded Interconnect Devices (MID). Different technological approaches like folding, cold and hot Embossing, Ceramic Injection Moulding and Additive Manufacturing are discussed.
Author(s)