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3D Multilayered Ceramics - harsh environment interposer technologies expand into 3rd dimension

 
: Ziesche, Steffen; Lenz, Christian; Müller-Köhn, Axel; Scheithauer, Uwe; Partsch, Uwe

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TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
5 pp.
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
IGF; 17921 BR; KOMBIPIM
English
Conference Paper
Fraunhofer IKTS ()
thick-film technology; ceramic multilayer technology; folding; embossing; ceramic injection moulding; additive manufacturing; lithography based ceramic manufacturing; aerosol jet printing

Abstract
The contribution deals with technologies to transform conventional planar ceramic interposers like thick film and multilayer ceramic substrates into functional 3D geometries comparable to polymer based Molded Interconnect Devices (MID). Different technological approaches like folding, cold and hot Embossing, Ceramic Injection Moulding and Additive Manufacturing are discussed.

: http://publica.fraunhofer.de/documents/N-531764.html