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Development and analysis of high temperature stable interconnections on thick films using micro resistance welding for sensors and MEMS

Development and analysis of high temperature stable interconnections on thick films using micro resistance welding technique for sensors and MEMS
 
: Gierth, Paul; Rebenklau, Lars

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TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings : 18th to 21st Sept. 2018, Dresden, Germany
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6814-6
ISBN: 978-1-5386-6813-9
ISBN: 978-1-5386-6815-3
5 pp.
Electronic System-Integration Technology Conference (ESTC) <7, 2018, Dresden>
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
VIP+; 03VP00112; FreeSense-HT
English
Conference Paper
Fraunhofer IKTS ()
interconnection; resistance welding; thick film; platinum

Abstract
Many sensor applications, particularly that of harsh environmental conditions, require high temperature stable interconnection techniques and materials. Monometallic Au-Au or Al-Al bonds have already been evaluated to be acceptable for temperatures over 300 °C. Nevertheless, novel concepts for surface applied thermocouples (TC) or surface acoustic wave sensors (SAW) need reliable bonding techniques for over 500 °C. Micro resistance welding of platinum alloys is a promising joining method for the production of high thermally stable bonds in such kind of packages. This study is focused on the mechanical stability of platinum-based interconnection joints. Therefore, characterization samples with commercially available thick film pastes were produced and welded using a parallel gap resistance welder. Pull and shear stability of the joints were evaluated and compared before and after long time isothermal treatment at high temperatures.

: http://publica.fraunhofer.de/documents/N-531763.html