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Thickness measurements with multistatic sparse arrays

: Keil, Andreas; Schreiner, Nina S.; Friederich, Fabian


Institute of Electrical and Electronics Engineers -IEEE-:
IRMMW-THz 2018, 43rd International Conference on Infrared, Millimeter, and Terahertz Waves : 9-14 September 2018, Nagoya Congress Center, Nagoya, Japan
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-3809-5
ISBN: 978-1-5386-3808-8
ISBN: 978-1-5386-3810-1
2 pp.
International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) <43, 2018, Nagoya>
Conference Paper
Fraunhofer ITWM ()

Thickness measurements using terahertz waves have received great attention in the area of industrial nondestructive testing. Currently these technologies are limited to individual thickness measurements using scanning probes. Within this contribution we demonstrate that a state of the art terahertz imaging system based on a multistatic sparse array can be used to acquire real-time data und to establish thicknesses of bulk materials on an industrial scale. We are discussing extensions how to go below the inherent resolution determined by the bandwidth of the signal.