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A review of acoustic impedance matching methods to validate additive manufactured metamaterial for capacitive micromachined ultrasonic transducers

: Schweiger, Severin; Koch, Sandro


Institute of Electrical and Electronics Engineers -IEEE-:
41st International Spring Seminar on Electronics Technology, ISSE 2018 : 16-20 May 2018, Zlatibor
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-5731-7
ISBN: 978-1-5386-5730-0
ISBN: 978-1-5386-5732-4
International Spring Seminar on Electronics Technology (ISSE) <41, 2018, Zlatibor/Serbia>
Conference Paper
Fraunhofer IPMS ()

This review analyses methods for acoustic impedance matching that are used on ultrasonic transducers to increase acoustic energy transmission into the load medium. A capacitive micromachined ultrasonic transducer (CMUT) emits sound via electrostatic deflection of a membrane electrode. Especially air-coupled CMUTs exhibit a notable impedance mismatch. We propose a new approach to fabricate impedance matching metamaterials with extremely low load-side specific acoustic impedance values and an extraordinary level of control over gradient attributes, by employing a photolithographic additive manufacturing technology. It will enable gradient impedance matching, which has a beneficiary effect on acoustic bandwidth, efficiency and sensitivity of the CMUT.