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Applicability of photonic sintering and autoclaving as alternative contact formation methods for silicon solar cells with passivating contacts

: Schube, J.; Fellmeth, T.; Maier, F.; Keding, R.; Clement, F.; Glunz, S.W.


Ballif, C. ; American Institute of Physics -AIP-, New York:
SiliconPV 2018, 8th International Conference on Crystalline Silicon Photovoltaics : 19-21 March 2018, Lausanne, Switzerland
Woodbury, N.Y.: AIP, 2018 (AIP Conference Proceedings 1999)
ISBN: 978-0-7354-1715-1
Art. 040019, 10 pp.
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) <8, 2018, Lausanne>
Conference Paper
Fraunhofer ISE ()
Photovoltaik; Silicium-Photovoltaik; Pilotherstellung von industrienahen Solarzellen; printing; contact; heterojunction; sintering; autoclaving

Photonic sintering, both with ultraviolet and near-infrared radiation, as well as thermal sintering with pressurization (autoclaving) is compared to a typical thermal curing of metal grids printed on heterojunction solar cells. For the metallization with screen printing, besides a polymer-based silver paste designed for photovoltaics, two commercially available pastes developed for the printed electronics industry have been chosen. One is optimized for autoclaving and the other for photonic sintering. With ultraviolet photonic sintering using a non-optimized process, lateral resistivities of the screen-printed contact fingers ρl of 7.6 µΩcm and contact resistivities at the metal/TCO interface ρc of 6.0-9.1 mΩcm2; are achieved. This is comparable to results reached with conventional thermal curing. Thereby, the main advantage of photonic sintering is the potential of significantly reducing the sintering time tsintering from 30 min to milliseconds. With autoclaving and near-infrared photonic sintering, lateral resistivities of 10.9 and 11.9 µΩcm are achieved, respectively.