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Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICs

 
: Bose, I.R.; Palavesam, N.; Landesberger, C.; Kutter, C.

:
Fulltext ( - Gesamte Proceedings)

Yurish, S.Y. ; International Frequency Sensor Association -IFSA-, Brussels:
Advances in Microelectronics: Reviews. Vol.1
Barcelona: IFSA Publishing, 2018
ISBN: 978-84-697-8633-8
ISBN: 978-84-697-8634-5
pp.313-327
European Commission EC
FP7; 317488; CONTEST
English
Book Article, Electronic Publication
Fraunhofer EMFT ()

: http://publica.fraunhofer.de/documents/N-525120.html