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Use of a solid immersion lens for thermal IR imaging

: Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.; Gottschalk, V.

Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
ISTFA 2006, 32th International Symposium for Testing and Failure Analysis. Proceedings : Austin Texas, 12th-16th November 2006
Materials Park, Ohio: ASM International, 2006
ISBN: 0-87170-844-2
ISBN: 978-0-87170-844-1
International Symposium for Testing and Failure Analysis (ISTFA) <32, 2006, Austin/Tex.>
Conference Paper
Fraunhofer IWM ()
thermography; failure localization; hot spot detection

A hemispherical silicon solid immersion lens (SIL) was used to improve the spatial resolution of front-side thermal IR imaging in lock-in mode. The bottom of the SIL was cone-shaped to reduce the footprint of the SIL to the size of the imaged region. Caused by the lock-in operation mode, the detection limit improves by 2-3 orders of magnitude, and scattered light does not limit the image contrast. By using this SIL in combination with an IR camera working in the 3-5 µm wavelength rage, a spatial resolution of 1.4 µm was obtained for thermal IR imaging. An automatic SIL positioning facility was constructed to place the SIL exactly in the center of the imaged region and to easily remove it after the detailed investigation.