Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization

 
: Septriani, B.; Pleguezuelo, P.R.; Beckert, E.; Eberhardt, R.; Tünnermann, A.

Otto, T. ; Messe Frankfurt; Fraunhofer-Institut für Elektronische Nanosysteme -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems : Dresden, Germany, 11 - 12 April 2018
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018
ISBN: 978-3-95735-082-4
ISBN: 3-95735-082-4
ISBN: 978-1-5108-6771-0 (Ausgabe bei Curran)
pp.504-507
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>
Smart Systems Integration Conference (SSI) <2018, Dresden>
English
Conference Paper
Fraunhofer IOF ()

Abstract
Laser based solder-bumping technique, known as solderjet, is a highly suited technology for building a miniaturized optical devices with strict demand for robustness and stability, such as laser devices for space applications. We investigate the bond strength and the impact of the soldering to the stress induced on the soldered component.

: http://publica.fraunhofer.de/documents/N-520761.html