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Silicon lens arrays for wafer level packaging of IR-sensors

 
: Kulkarni, A.; Malaurie, P.; Stenchly, V.; Quenzer, H.J.; Laske, N.; Dudde, R.

Laudon, M. ; TechConnect, Austin/Tex.:
TechConnect briefs 2018. Vol.4: Informatics, electronics and microsystems
Danville, CA: TechConnect, 2018
ISBN: 978-0-9988782-5-6
pp.147-150
TechConnect World Innovation Conference and Expo <2018, Anaheim/Calif.>
Nanotech Conference & Expo <21, 2018, Anaheim/Calif.>
English
Conference Paper
Fraunhofer ISIT ()

Abstract
A new process technology has been developed for a cost efficient production of refractive convex lenses made of silicon. These lenses are produced as lens arrays on standard eight inch Si-wafers to allow the optical capping of IR sensors in a wafer level packaging (WLP) process. A manufacturing process is described using a glass forming process with thin (50um) AF32® glass wafers. Si-spheres of well-defined diameter are transferred to a thin glass membrane on top of a Si-wafer with prefabricated cylindrical openings. In a thermal bonding process, the lens part of the Si-spheres sinks into the cavities while the outer part is grinded away. The resulting plano-convex lens calottes remain firmly embedded in the wafer surface. In this manner an array of Si-lenses on a Si-wafer is realized to be used as cover wafer for wafer level packaging of IR-sensor devices. First designs of Si-lens arrays have been fabricated. Starting with Si-spheres of radius of curvature 0.8 mm conv ex lenses of 0.82 mm diameter (aperture) and a sagittal height of 0.12 mm were produced.

: http://publica.fraunhofer.de/documents/N-520744.html