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Die attach for high power VCSEL array systems

 
: Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.

Otto, T. ; Messe Frankfurt; Fraunhofer-Institut für Elektronische Nanosysteme -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems : Dresden, Germany, 11 - 12 April 2018
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018
ISBN: 978-3-95735-082-4
ISBN: 3-95735-082-4
ISBN: 978-1-5108-6771-0 (Ausgabe bei Curran)
pp.412-415
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>
Smart Systems Integration Conference (SSI) <2018, Dresden>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Vertical Cavity Surface Emitting Lasers (VCSEL) are commonly used for sensing, data-com and other low power applications. VCSELs are highly reliable and have great potential for low cost and robust solutions. Therefore, there is a growing interest to use them for high power demanding tasks such as pump modules for solid-state laser surface cleaning or heating applications. By arranging single VCSELs in arrays, high power VCSELs systems in kilowatt range can be built [1]. In order to realize highly reliable High Power VCSELs arrays systems with an optimized optical output an excellent thermal management is necessary. Therefore the VSCELs modules are mounted with metallic interconnection technologies like silver sintering and soldering using AuSn and SnAg-Solder for an advanced heat transfer and cooled with micro structured water copper cooler [2][3].

: http://publica.fraunhofer.de/documents/N-520619.html