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Investigation of high pressure Ag sintered joints manufactured with different tools

 
: Kripfgans, J.; Weber, C.; Hutter, M.

Otto, T. ; Messe Frankfurt; Fraunhofer-Institut für Elektronische Nanosysteme -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems : Dresden, Germany, 11 - 12 April 2018
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018
ISBN: 978-3-95735-082-4
ISBN: 3-95735-082-4
ISBN: 978-1-5108-6771-0 (Ausgabe bei Curran)
pp.428-431
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>
Smart Systems Integration Conference (SSI) <2018, Dresden>
English
Conference Paper
Fraunhofer IZM ()

Abstract
High pressure sintering of thin semiconductors is a challenging task. The pressure is used to ensure a high level of sinter layer quality and can lead to undesired die warpage. One strategy to improve the planarity of the dies is to decrease stresses inside the semiconductors through intelligent sintering tool solutions. This investigation takes into account the particularities using different tools for pressure sintering.

: http://publica.fraunhofer.de/documents/N-520551.html