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A new method for prediction of corrosion processes in Aluminum housing materials for electronic components

 
: Klengel, S.; Stephan, T.; Mühs-Portius, B.

:

Dziedzic, A. ; Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-, Poland Chapter:
21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings : Warsaw, 10-13 September 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-0-9568086-4-6
ISBN: 978-1-5386-2309-1
pp.159-164
European Microelectronics Packaging Conference (EMPC) <21, 2017, Warsaw>
English
Conference Paper
Fraunhofer IMWS ()

Abstract
We developed a method based on potentiostatic measurements which allows corrosion sensitivity analyzes of coated Aluminum housings in a very short time. Using a NaCl electrolyte combined with electrical potential accelerates the corrosion reaction and initiates typical application related corrosion processes. In this paper we will present and discuss our method for corrosion testing in correlation to the standard salt spray test. Furthermore high resolution microstructural analyzes are giving evidence for the running corrosion process. We will show microstructural results by Scanning Electron Microscopy (SEM) and element analyzes (EDS) for samples potentiostatic tested. Finally the corrosion processes induced will be compared and discussed.

: http://publica.fraunhofer.de/documents/N-520416.html