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Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale

 
: Schriefer, T.; Hofmann, M.

:

Driel, W.D. van (Ed.) ; Institute of Electrical and Electronics Engineers -IEEE-:
19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 : 15-18 April 2018, Toulouse, France
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-2358-9
ISBN: 978-1-5386-2359-6
ISBN: 978-1-5386-2360-2
pp.67-73
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <19, 2018, Toulouse>
English
Conference Paper
Fraunhofer IISB ()

Abstract
This paper presents a methodology to holistically analyse the effects of vibrational loads on electronic systems. An equivalent multi degree-of-freedom (DOF) damped system discretizes the complex structure and sets up the equation of motion. After modal testing the damping and stiffness coefficients, a numerical finite element model (FEM) is developed to identify critical components based on the mass participation factor. Including the system vibration behaviour by means of the characteristic transfer functions, the critical components are linear sub-modelled in the frequency domain to minimize calculation times. The statistical stress configuration caused by normally distributed random vibration cycles reveals electrical devices prone to significant damage. The mechanical damage in terms of high cycle fatigue is quantified in a second hierarchic linear submodel that considers both transfer functions and stress configuration of the critical components. By Inverse Fast Fourier transforming this input load from frequency to the time domain, it finally enables non-linear material models in the device submodel and the calculation of cumulative damage.

: http://publica.fraunhofer.de/documents/N-520338.html