Microplasma source for microstructured surface treatment at atmospheric pressure

We present an improved microplasma source based on the principle of dielectric barrier discharge, which is applied to a new kind of area selective surface modification processes at atmospheric pressure. These processes integrate the surface treatment and lateral microstructuring within one process step. For this purpose the microplasma will be generated in cavities which are formed temporarily by the substrate to be treated area-selectively and a so-called plasma stamp.