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A multichip module integration technology for high-speed analog and digital applications

: Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.

International Union of Radio Science -URSI-:
URSI International Symposium on Signals, Systems, and Electronics 1998. Conference proceedings : 29 September - 2 October, 1998, Palazzo dei Congressi, Pisa, Italy
New York, NY: IEEE, 1998
ISBN: 0-7803-4900-8
ISBN: 0-7803-4901-6
International Symposium on Signals, Systems, and Electronics (ISSSE) <1998, Pisa>
Conference Paper
Fraunhofer IZM ()
multichip module; integration technology; high-speed; analog; digital; application

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected through a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered / electroplated copper wiring on ceramic or silicon substrate. Polyimid PyralinTM (2722 (Du Pont) and CycloteneTM (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction.