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Highly integrated chips

Super-brains for the IoT age
 
: Ramm, P.; Weber, J.

Fraunhofer-Verbund Mikroelektronik:
Fraunhofer VµE - Microelectronics News. Ausgabe 65 : February 2017
Berlin: Fraunhofer-Verbund Mikroelektronik VµE, 2017
pp.3
English
Journal Article
Fraunhofer EMFT ()

Abstract
Without microelectronics, the “Internet of Things” (IoT) would be blind, deaf, and mute. But in order to be able to keep up with rapid development in this digital age, chips must become smaller, more multifunctional, and more powerful. 3D integration is considered a key technology in order to keep moving the boundaries of the possible further out.

: http://publica.fraunhofer.de/documents/N-515721.html