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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Industrially compatible PCB stacking technology for miniaturized sensor systems

 
: Lang, K.D.; Großer, V.; Amiri Jam, K.; Wolf, J.; Semionyk, P.; Schmitz, S.; Rochlitzer, R.; Prietzsch, D.; Reichl, H.

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IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2005, 7th Electronics Packaging Technology Conference
New York, NY: IEEE, 2005
ISBN: 0-7803-9578-6
ISBN: 0-7803-9579-4
pp.13-18
Electronics Packaging Technology Conference (EPTC) <7, 2005, Singapur>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-51406.html