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Ultra-fast laser micro processing by multiple laser spots

: Bruening, S.; Du, K.; Jarczynski, M.; Jenke, G.; Gillner, A.

Fulltext ()

Procedia CIRP 74 (2018), pp.573-580
ISSN: 2212-8271
International Conference on Photonic Technologies <10, 2018, Fürth>
Journal Article, Conference Paper, Electronic Publication
Fraunhofer ILT ()

In the direct processing of three dimensional micro structures for surface functionalization, usp-lasers provide the necessary resolution and quality. The increasing resolution brings along a rising machining time which leads to the unavoidable demand of multiple spots. In this paper a newly developed high compact ps-laser with repetition rates of up to 8 MHz and an average power of 500 W was distributed by a diffractive element on a 16 channel acousto optical modulator that individually modulates each of the 16 spots. The typical laser based micro processing method was enhanced to reach a machining technology in which 16 different layers could be processed within one path. In a further step, 4 of these high compact beam deliveries could be integrated in one cylinder micro processing system to generate at least 64 individual acting laser spots. Different functional structures were processed and shown in this paper.