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Interposer - an enabling technology for fan-out hybrid pixel modules

 
: Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.

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18th iWoRiD, International Workshop on Radiation Imaging Detectors 2016. Book Abstracts : 3-7 July 2016, Barcelona, Spain
Barcelona, 2016
pp.12
International Workshop on Radiation Imaging Detectors (IWORID) <18, 2016, Barcelona>
English
Abstract, Electronic Publication
Fraunhofer IZM ()

Abstract
Hybrid pixel detector modules are the main building blocks of silicon particle tracking detectors in high energy physics experiments as well as in x-ray cameras for research and development using synchrotron radiation. In most of the application the pixel pitch is the same for the electronic readout chips and the solid state pixel sensor. With this approach larger sensor tiles have to be connected to multiple readout chips. The idea presented here offers a more flexible hybrid module concept. Using a silicon interposer with copper-filled through silicon vias (TSVs) the high density pixel pitch of the electronic readout ASIC can be redistributed to a flexible sensor pixel pitch adapted to the requirements of the application. This fan-out hybrid pixel module approach opens a wide range for the use of different sensor configurations and materials. The state of the art of the interposer technology in industrial application will be described in this presentation. Silicon interposers with high density redistribution offer leading edge performance of new FPGA and high end GPU concepts today. Starting from the concept of fan-out hybrid pixel module the individual process steps of interposer manufacturing up to the interconnection technology will be described in detail. These are the routing of the high density pitch on readout ASIC side using frontend feature size and technology, the formation of through silicon via and an overview of available interconnection technologies for readout ASIC assembly as well as the interconnection of sensor tiles. Glass can be used as an interposer material as well due to its good electrical isolation characteristic. New results of technological process development and material characterization of glass interposers will be presented. The development of these devices is driven by the reduction of interposer thickness and the reduction of through glass via (TGV) diameter and pitch. To summarize the presentation an overview of interposer processed at Fraunhofer IZM for several applications will be shown.

: http://publica.fraunhofer.de/documents/N-510094.html