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Flexible high density active neural implants combining a distributed multiplexing transceiver architecture with biocompatible technology

 
: Marcoleta, Juan Pablo; Nogueira, Waldo; Froriep, Ulrich Paul; Doll, Theodor

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Physica status solidi. A 215 (2018), No.15, Art. 1700134, 10 pp.
ISSN: 0031-8965
ISSN: 1862-6300
ISSN: 1521-396X
ISSN: 1862-6319
English
Journal Article
Fraunhofer ITEM ()
biocompatible technology; Brain Computer Interface; Cochlea implant; ECoG array; electronic grain; epilepsy; multiplexing architecture; thin film implant

Abstract
Precise localization of brain tissue causing severe neurological conditions requires subdural recording arrays with high electrode density and low mechanical stiffness compliant with the brain tissue. However, most arrays currently used − such as clinical ECoG grids − are rather stiff and limited in spatial resolution. To overcome these constrains a novel architecture is proposed using delocalized electronic (de)multiplexer grains. Here, their functional units are described in both hard‐ and software, and tested in simulations and experimentally. The results show that in case of a 100 × 100 mm ECoG array with lower mechanical stiffness, inter‐electrode distances <1 mm can be achieved. Taking parasitic capacitances into account, a signal resolution of 100 μV is reached with an inter‐channel timing resolution of 200 ns, which in our model corresponds to tissue localization as precise as 1.2 mm. For clinical application of envisaged 5000 electrodes, a preselection mechanism and routes for adoption of this technology toward cochlear implants and brain computer interfaces are presented.

: http://publica.fraunhofer.de/documents/N-510073.html