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Study of a laser packaging technique simulated with ANSYS and virtuallab fusion software

: Ribes-Pleguezuelo, P.; Zhang, S.; Beckert, E.; Eberhardt, R.; Wyrowski, F.; Tünnermann, A.


Optical Society of America -OSA-, Washington/D.C.:
Laser Ignition Conference 2017 : 20-23 June 2017, Bucharest, Romania
Washington, DC: OSA, 2017
ISBN: 978-1-943580-32-3
Paper LWA2.4
Laser Ignition Conference (LIC) <5, 2017, Bucharest>
Conference Paper
Fraunhofer IOF ()

Mechanico-optical simulations performed with ANSYS and VirtualLab Fusion software to analyze stress-induced birefringence for the packaging of a laser ignition device by a low-stress soldering technique showed almost no influence on the laser output beam.