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Alternative solder deposition using transfer technique

 
: Töpper, M.; Wolf, J.; Reichl, H.

Reichl, H.; Heuberger, A. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '96 : 5th International Conference on Micro Electro, Opto, Mechanical Systems and Components, Potsdam, September 17 - 19, 1996
Berlin: VDE-Verlag, 1996
ISBN: 3-8007-2200-3
pp.99-104
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <5, 1996, Potsdam>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Flip-chip mounting using soft solder offers several advantages in comparison with other chip-mounting technologies both in processing and performance and makes this technology very attractive especially for multichip modules (MCMs). FC devices lend their very good electrical performance to the short interconnects to make them suited for high speed applications. Highest I/O counts can be handled by introducing area array.

: http://publica.fraunhofer.de/documents/N-50658.html