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The european CSP perspective

 
: Töpper, M.; Schubert, A.; Reichl, H.

Elektronik, Produktion und Prüftechnik : EPP (2000), No.8, pp.66-68
ISSN: 0172-6250
ISSN: 0943-0962
English
Journal Article
Fraunhofer IZM ()

Abstract
Packaging technology determines the size, weight, ease-of-use, durability, reliability, performance and cost of electronics. As the complexity of devices is rapidly increasing, the packaging plays a major role. This perspective on chip-scale packages (CSP) is based on research in Europe’s industry for its area-array packaging plans until 2004.

: http://publica.fraunhofer.de/documents/N-50634.html