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Microsystem and microelectronic devices investigated by synchrotron-radiation imaging techniques

: Helfen, L.; Myagotin, A.; Baumbach, T.; Dimichel, M.; Kröning, M.

Fulltext urn:nbn:de:0011-n-505104 (175 KByte PDF)
MD5 Fingerprint: fb8f8153b78b9772c26592d99d7208b7
Created on: 27.8.2009

Deutsche Gesellschaft für Zerstörungsfreie Prüfung e.V. -DGZfP-, Berlin; European Federation for Non-Destructive Testing -EFNDT-:
9th European Conference on NDT. ECNDT Berlin 2006. CD-ROM : September 25 - 29, 2006
Berlin: DGZfP, 2006 (DGZfP Proceedings BB 103-CD)
ISBN: 3-931381-86-2
European Conference on NDT (ECNDT) <9, 2006, Berlin>
Conference Paper, Electronic Publication
Fraunhofer IZFP ()
synchrotron radiation; Synchrotronstrahlung

Due to increasing packing density and ongoing miniaturization there is a growing need for non-destructive quality assurance of devices in microsystem technology, especially for techniques providing high spatial resolution. The tendency towards short electrical interconnections often results in burried structures which cannot be verified visually. In laboratories, various x-ray techniques are routinely applied to provide non-destructive insight into materials and devices. Successful application to microsystem devices is sometimes restricted, however, for instance due to limited spatial resolution and/or intensity of laboratory x-ray imaging setups. X-ray imaging using synchrotron radiation allows us to overcome a number of limitations. This paper introduces principles of both laboratory and synchrotron methods and shows their applications to imaging of microelectronic devices. Typical tasks of quality inspection usually accompanying the microsystem development cycle are demonstrated by examples of various fields of application. High-resolution and phase-contrast radiography is used to detect delaminations between substrates and glob tops encapsulating wire-bonded devices. By threedimensional (3d) imaging techniques as computed tomography (CT) we are able to image objects three-dimensionally with a spatial resolution down to the submicrometre scale. Recently, synchrotron-radiation computed laminography SRCL) has been implemented to image three-dimensionally flat and laterally extended objects with high spatial resolution. Examples of flip-chip bonded and wire-bonded devices highlight the potential of SRCL in typical microsystem applications like the detection of ?m-sized voids within flip-chip solder bumps along with their 3d positions in the bump. Moreover, as demonstrated by the study of two-dimensional hybrid x-ray sensor arrays with a high number of flip-chip interconnections, diffraction imaging methods have been developed and applied to investigate lattice deformations due to stress in (mono-)crystalline materials.