Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

3-D overlay assembly of mechanical components with sub-micron accuracy

 
: Mohaupt, M.; Eberhardt, R.; Beckert, E.; Damm, C.; Peschel, T.; Tünnermann, A.

Zervos, H. ; European Society for Precision Engineering and Nanotechnology -EUSPEN-:
6th International Conference of the European Society for Precision Engineering and Nanotechnology 2006. Proceedings : May 28th - June 1st, 2006, Baden bei Wien, Vienna
Bedford: Euspen, 2006
ISBN: 0-9553082-0-8
ISBN: 978-0-9553082-0-8
pp.60-63
European Society for Precision Engineering and Nanotechnology (International Conference) <6, 2006, Baden bei Wien>
European Society for Precision Engineering and Nanotechnology (Annual General Meeting) <8, 2006, Baden bei Wien>
English
Conference Paper
Fraunhofer IOF ()
measurement; flexure hinge; mark detection; capacitive measurement system

Abstract
The assembly of complex and high precise mechanical devices often requires the all nment of functional elements in a sub-micron range. But during the manufacturing of stacks the used alignment structures, e.g. alignment marks, might get masked by mechanical parts in the subsequent assembly steps. So for a permanent monitoring of the alignment Status of all components the position of the assembled and aligned components has to be transferred from one measuring system to another.
This paper is focused an the precision assembly and the special alignment procedure for a stack of silicon plates to be used in a Mask-Less Lithography Tool. The requirements of the sub - micron assembly will be discussed in the context of measuring, alignment and environmental constraints.

: http://publica.fraunhofer.de/documents/N-50403.html