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TAIKO wafer ball attach

 
: Schröder, S.; Schröder, M.; Reinert, W.; Priewasser, K.H.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings : 30. November - 3 December 2016, Singapore
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-4368-2
ISBN: 978-1-5090-4369-9
ISBN: 978-1-5090-4370-5
pp.450-454
Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>
English
Conference Paper
Fraunhofer ISIT ()

Abstract
Ball attach on ultra-thin 200 mm TAIKO wafers is considered a challenge but it can be mastered. The TAIKO wafer grinding concept is based on the thinning of an inner area of a silicon wafer leaving an outer ring as stiffening frame for wafer handling without an additional carrier [1]. The process development methodology for a near industrial TAIKO wafer balling pilot line is described. A phased process development methodology was applied with different residual wafer thicknesses, wafer ball diameters and balling pitches to check yield affecting topics and process throughput.

: http://publica.fraunhofer.de/documents/N-502687.html