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Non-overlapping power/ground planes for localized power distribution network design

 
: Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-6185-3
ISBN: 978-1-5090-6184-6
ISBN: 978-1-5090-6186-0
pp.7-9
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <15, 2016, Honolulu/Hawaii>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Power/ground planes are used for low IR-drop and inductance, but they also cause switching noise coupling globally across chip packages and printed circuit boards. The switching noise coupling is a concern for mixed-signal boards, high-speed I/Os, and electromagnetic compatibility. In GHz frequency regime, switching noise cannot be controlled by off-chip discrete decoupling capacitors due to their inductance. In this paper we introduce the non-overlapping power/ground planes design methodology for filtering of GHz power plane noise. Unlike existing approaches, our approach is simple, has wide bandwidth, and does not increase IR-drop or inductance.

: http://publica.fraunhofer.de/documents/N-502661.html