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Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles

 
: Poonjal Pai, A.; Reiter, T.; Maerz, M.

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 : 5-7 April 2017, Delft, Netherlands
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-4278-4
ISBN: 978-1-5090-4279-1
pp.15-19
International Workshop on Integrated Power Packaging (IWIPP) <2017, Delft>
English
Conference Paper
Fraunhofer IISB ()

Abstract
This paper evaluates the benefits of replacing the Si diodes of a commercial IGBT module for the main inverter application of an electric vehicle with SiC diodes, leaving the other components of the package and the system unchanged. This will give a direct comparison of Si vs SiC diodes, without giving scope for discrepancies arising out of differences in the packaging, gate-driver circuit etc. The IGBT-module chosen for comparison is a low inductance (8nH) HybridPACK Drive module from Infineon, suitable for high speed switching. A loss model is developed for the modules, and the resulting model is used to investigate the performance for various drive cycles (Artemis, WLTP, NEDC). A calorimetric loss measurement setup is developed for experimental verification of the results.

: http://publica.fraunhofer.de/documents/N-502646.html