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Novel EDA Tools for system planning and 3D layout design of smart items

 
: Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.

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International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter; Institute of Electrical and Electronics Engineers -IEEE-:
IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017 : June 18-20, 2017, Göteborg, Sweden
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-3055-6
ISBN: 978-1-5386-3056-3 (Print)
pp.1-6
Nordic Conference on Microelectronics Packaging (NordPac) <2017, Göteborg>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper introduces concept and functionalities of two novel electronic design automation EDA Tools for system planning and 3D layout design of smart items. These tool functionalities allow first feasibility decisions and pre-layout analysis in a early design stage. Thus, the quality of the design process can be ensured and expensive re-design can be avoided.

: http://publica.fraunhofer.de/documents/N-502620.html