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3D integration technologies for MEMS

 
: Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.

:

Jiang, Y.-L. ; Institute of Electrical and Electronics Engineers -IEEE-; Institute of Electrical and Electronics Engineers -IEEE-, Beijing Section:
13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016. Proceedings : Oct. 25- Oct. 28, 2016, Hangzhou, China
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-4673-9719-3
ISBN: 978-1-4673-9717-9 (Print)
ISBN: 978-1-4673-9718-6
ISBN: 978-1-4673-9720-9
pp.334-337
International Conference on Solid-State and Integrated Circuit Technology (ICSICT) <13, 2016, Hangzhou>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography.

: http://publica.fraunhofer.de/documents/N-502616.html