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Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz

 
: Qayyum, J.A.; Abt, M.; Roch, A.; Ulusoy, A.C.; Papapolymerou, J.

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Institute of Electrical and Electronics Engineers -IEEE-; Gallium Arsenide Application Symposium Association -GAAS-; IEEE Electron Devices Society:
12th European Microwave Integrated Circuits Conference, EuMIC 2017 : 9-12 October 2017, Nuremberg, Germany
Piscataway, NJ: IEEE, 2017
ISBN: 978-2-87487-048-4
ISBN: 978-1-5386-3966-5
pp.372-375
European Microwave Integrated Circuits Conference (EuMIC) <12, 2017, Nuremberg>
European Microwave Week (EuMW) <2017, Nuremberg>
European Microwave Conference (EuMC) <47, 2017, Nuremberg>
English
Conference Paper
Fraunhofer CCD ()

Abstract
In this paper, the authors present proof of concept 3D printed interconnects fabricated using aerosol jet printing (AJP) technology. A trapezoidal structure was 3D printed on Liquid Crystal Polymer (LCP) and Coplanar Waveguides (CPW) were printed on top of them to imitate mm-wave packaging. The printing was done using silver nanoparticle ink that acquired 40% conductivity of the bulk silver after sintering at 200 °C for one hour. Scattering Parameters (S-parameters) were simulated and measured from 1 GHz to 110 GHz. The CPW interconnects yielded insertion loss of as low as 0.49 dB/mm including the trapezoid, and with a loss of 0.38 dB/mm on LCP substrate at 110 GHz. This work represents AJP as a solution for cost-effective system-on-package (SoP)/ millimeter-wave (mm-wave) systems.

: http://publica.fraunhofer.de/documents/N-502438.html