Präzisionshandlingsystem zur Feinjustage von Sende- und Empfangsmodulen

Abstract
The precision problem in mechanical micro system fabrication arises with increasing accurate alignments between process steps, especially in position and angle distortion with 6 DOF. The applied process chain contains 5- axis die and mold cutting, 3D micro forming, 5 axis assembly and 3D-measurements. measurements. Hybrid systems for local position assignment are preferred in micro-processing equipment, which are needed for handling tools and work pieces with sub-micrometer accuracy in multiple setups. Milled alignment targets in the die reliability. are necessary for their embossing replication in optofoils and for assembly alignment techniques, which deliver a continuous process concept with highest reliability. The 5axis assembly system allows positioning and fixing of micro components with a repeatability 0,5µm in 5 of 6 DOF. A new alignment tool was developed and tested - a tilt gripper with TCP in the gripped part. Central monitoring camera watches the assembly process through the gripper, multi-sensor measurements allow 3D measurements. The application describes the successful assembly process of optical PCB with printed wave-guides. The described methodology and know how is applicable to future modular machining systems.