Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Modular micro machining, assembly and quality control concept in 6 DOF

Präzisionshandlingsystem zur Feinjustage von Sende- und Empfangsmodulen
 
: Schubert, A.; Schulz, B.; Koriath, H.-J.

:
Postprint urn:nbn:de:0011-n-501320 (817 KByte PDF)
MD5 Fingerprint: a83a813bd074a008acb82c69a6a227bc
Created on: 30.3.2011


Drews, P. ; European Center for Mechatronics; IEEE Industrial Electronics Society:
Mechatronics and Robotics '04. Vol.4 : Aachen - Germany, September 13 - 15, 2004
Aachen: Eysoldt, 2004
ISBN: 3-938153-30-X
ISBN: 3-938153-50-X
pp.1590-1593
International Conference on Mechatronics and Robotics (MECHROB) <2004, Aachen>
English
Conference Paper, Electronic Publication
Fraunhofer IWU ()
Präzisionshandlingsystem; Präzisionsmontage; optische Leiterplatte; Lagefehlerkompensation; Feinpositionierung; Winkellagekorrektur; Winkelfeinstellung; greiferintegrierte Winkelfeinstellung; Passive Montage; precision handling system; precision assembly; optical circuit board; alignment; error compensation; fine positioning; correction of angle position; high precision; angle adjustment; gripper integrated angle adjustment; passive assembly strategy

Abstract
The precision problem in mechanical micro system fabrication arises with increasing accurate alignments between process steps, especially in position and angle distortion with 6 DOF. The applied process chain contains 5- axis die and mold cutting, 3D micro forming, 5 axis assembly and 3D-measurements. measurements. Hybrid systems for local position assignment are preferred in micro-processing equipment, which are needed for handling tools and work pieces with sub-micrometer accuracy in multiple setups. Milled alignment targets in the die reliability. are necessary for their embossing replication in optofoils and for assembly alignment techniques, which deliver a continuous process concept with highest reliability. The 5axis assembly system allows positioning and fixing of micro components with a repeatability 0,5µm in 5 of 6 DOF. A new alignment tool was developed and tested - a tilt gripper with TCP in the gripped part. Central monitoring camera watches the assembly process through the gripper, multi-sensor measurements allow 3D measurements. The application describes the successful assembly process of optical PCB with printed wave-guides. The described methodology and know how is applicable to future modular machining systems.

: http://publica.fraunhofer.de/documents/N-50132.html