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New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"

 
: Landesberger, Christof; Bose, Indranil; König, Martin; Kutter, Christoph

Knechtel, Roy (Ed.) ; Interuniversity Micro-Electronics Center -IMEC-, Louvain:
WaferBond 2017, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 27th - 29th Novmber 2017, Leuven, Belgium
Leuven: IMEC, 2017
pp.45-46
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2017, Leuven>
English
Conference Paper
Fraunhofer EMFT ()
mobile electrostatic carrier; e-carrier; thin wafer handling; thinwafer processing

Abstract
We present a new approach to realize a cost effective mobile electrostatic carrier technology that is supposed to enable high temperature processes performed at very thin or fragile semiconductor wafers. The new E-Foil concept uses roll-to-roll manufacture of electrode patterns on film substrates and allows for re-charging during a semiconductor wafer process. E-Foil carriers with both fine line interdigitated electrodes and large electrode areas were prepared at Fraunhofer EMFT and first results are presented in the paper. We suggest E-Foil carrier systems as unique solution for plasma dicing of ultra-thin device wafers.

: http://publica.fraunhofer.de/documents/N-500026.html