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MCM-D with embedded active and passive components

 

International Society for Hybrid Microelectronics -ISHM-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 1996. Proceedings : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota
Bellingham/Wash.: SPIE, 1996 (SPIE Proceedings Series 2920)
ISBN: 0-930815-48-3
pp.224-229
International Symposium on Microelectronics <1996, Minneapolis/Minn.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured windows of ceramic substrates and fixed in their position. A standard thinfilm multilayer is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W / Cu tie layer, which is subsequently electroplated. Cyclotene 4026-46 is used as interlevel dielectric. The embedding technology is verified by an SRAM-MCM thas is comprised of 8 SRAMs and 4 capacitors interconnected by a four layer Cu-metallization.

: http://publica.fraunhofer.de/documents/N-49617.html