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Low cost electroless copper metallization of BCB for high-density wiring systems

 
: Töpper, M.; Stolle, T.; Reichl, H.

:

Wong, C.P. ; International Microelectronics and Packaging Society -IMAPS-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings
Reston, Va.: IMAPS, 1999
ISBN: 0-930815-56-4
ISBN: 0-7803-5508-3
pp.202-208
International Symposium on Advanced Packaging Materials <5, 1999, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A technology development of a fully additive and selective metallization process for a structured Copper metallization on BCB was evaluated. Today semiadditive processes including vacuum steps are the most common thin film metallization technologies. Reducing the number of process steps and avoiding sputtering processes will reduce the cost of interconnection technologies for all varieties of electronic packaging.

: http://publica.fraunhofer.de/documents/N-49614.html