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1999
Conference Paper
Titel
Low cost electroless copper metallization of BCB for high-density wiring systems
Abstract
A technology development of a fully additive and selective metallization process for a structured Copper metallization on BCB was evaluated. Today semiadditive processes including vacuum steps are the most common thin film metallization technologies. Reducing the number of process steps and avoiding sputtering processes will reduce the cost of interconnection technologies for all varieties of electronic packaging.