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Fracture and delamination of thin multilayers on ultra-thin silicon

 
: Kravchenko, G.; Bagdahn, J.

:

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005 : Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, April 18, 19, 20, 2005, Radisson Hotel, Berlin, Germany
Piscataway, NJ: IEEE Order Department, 2005
ISBN: 0-7803-9062-8
ISBN: 0-7803-9063-6
pp.419-422
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <6, 2005, Berlin>
English
Conference Paper
Fraunhofer IWM ()
CMOS; delamination; ultra thin chip; finite element analysis

Abstract
The paper analyzes delamination propagation and crack kinking between CMOS layers on the ultra thin silicon chip. Based on the fracture mechanics approach, a four-point bending specimen is analyzed with the help of the finite element modelling. Using the maximum hoop stress criterion, the crack kinking as the chip fracture initiation is predicted. Influence of T-stress on the crack kinking behaviour war also considered in the analysis.

: http://publica.fraunhofer.de/documents/N-49604.html