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Strength characterization of laser diced silicon for application in solar industry

: Schönfelder, S.; Bagdahn, J.; Baumann, S.; Kray, D.; Mayer, K.; Willeke, G.; Becker, M.; Christiansen, S.

Poortmans, J. ; European Commission, Joint Research Centre -JRC-:
21st European Photovoltaic Solar Energy Conference 2006. Proceedings. CD-ROM : Proceedings of the international conference held in Dresden, Germany, 4 - 8 September 2006
München: WIP-Renewable Energies, 2006
ISBN: 3-936338-20-5
European Photovoltaic Solar Energy Conference <21, 2006, Dresden>
Conference Paper
Fraunhofer IWM ()
defect; laser processing; strength; residual stress

Laser technologies are used in a wide range of process steps in solar industry. In this paper novel laser dicing technologies like LaserMicroJet® and Laser Chemical Etching (LCE) are investigated and compared to standard dry laser and sawin g process. It is shown that standard laser technology causes large flaws in the samples reducing the strength drastically. Different strength of front and back side of samples of LaserMicroJet® and Laser Chemical Etching are investigated by Raman spectroscopy and EBSD (Electron Backscattering Diffraction). It is shown that a layer of molten and solidified material induces stress in the sample surface reducing the strength of samples. In a second investigation different laser techniques are used for edge isolation on wafer samples. The evaluation of strength shows, that there is a significant influence of used grooving technology on the scattering of samples resulting in different strength behavior.