
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Process variability for devices at and beyond the 7 nm node
:
Postprint urn:nbn:de:0011-n-4940894 (990 KByte PDF) MD5 Fingerprint: 16aac0e0cd27301a79c7e5f0f6c10a82 Copyright 2018 The Electrochemical Society Created on: 22.1.2019 |
| Martino, J.A. ; Electrochemical Society -ECS-: Advanced CMOS-Compatible Semiconductor Devices 18 : Held during the 233rd Meeting of the Electrochemical Society, Seattle, Washington, May 13-17, 2018 Pennington, NJ: ECS, 2018 (ECS transactions 85. 2018, Nr.8) ISBN: 978-1-62332-488-9 ISBN: 978-1-62332-501-5 ISBN: 978-1-60768-836-5 pp.113-124 |
| Symposium "Advanced CMOS-Compatible Semiconductor Devices" <18, 2018, Seattle/Wash.> Electrochemical Society (ECS Meeting) <233, 2018, Seattle/Wash.> |
| European Commission EC H2020; 688101; SUPERAID7 Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node |
|
| English |
| Conference Paper, Electronic Publication |
| Fraunhofer IISB () |
| process variation; process simulation; device simulation; interconnect simulation; compact model; hierarchical simulation; nanowire transistor |
Abstract
Advanced CMOS devices are increasingly affected by various kinds of process variations. Whereas the impact of statistical process variations such as Random Dopant Fluctuations has for several years been discussed in numerous publications, the effect of systematic process variations which result from non-idealities of the equipment used or from various layout issues has got much less attention. Therefore, in the first part of this paper, an overview of the sources of process variability is given. In order to assess and minimize the impact of variations on device and circuit performance, relevant systematic and statistical variations must be simulated in parallel, from equipment through process to device and circuit level. Correlations must be traced from their source to the final result. In this paper the approach implemented in the cooperative European project SUPERAID7 to reach these goals is presented.