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Approach for a standardized methodology for mulit-site processing of 300 mm wafers at R&D-sites

 
: Öchsner, R.; Frickinger, J.; Pfeffer, M.; Schellenberger, M.; Roeder, G.; Pfitzner, L.; Ryssel, H.; Fritzsche, M.; Kaushik, V.; Renaud, D.; Danel, A.; Claeys, C.; Bearda, T.; Lering, M.; Graef, M.; Murphy, B.; Walther, H.; Hury, S.

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Japan Society of Applied Physics -JSAP-; IEEE Electron Devices Society; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
ISSM 2006, Fifteenth International Symposium on Semiconductor Manufacturing. Conference Proceedings : September 25 - 27, 2006, Century Hyatt Tokyo, Japan
Piscataway/NJ: IEEE, 2006
ISBN: 978-4-9904138-0-4
pp.487-490
International Symposium on Semiconductor Manufacturing (ISSM) <15, 2006, Tokyo>
English
Conference Paper
Fraunhofer IISB ()
multi-site processing; 300 mm; contamination control; functional model; interface; wafer ID; tracking; process flow; nanotechnology; CMOS

Abstract
This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro- and nanotechnologies to a distributed 300 mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multi-site processing. An implementation phase is planed in a second step.

: http://publica.fraunhofer.de/documents/N-49389.html